Pay in 4 interest-free payments of $48.25 Learn more
Ships within 48 hours · Estimated delivery Jul 31 - Aug 5
orgで入手可能となる。初版は1989年発行。前版は2003年3月発行。
SEMI MF1152 — Test Method for Dimensions of Notches on Silicon Wafers
This Document covers requirements for phosphine used in the semiconductor industry
the user must be specific in the selection of the tube and welded fitting s to be evaluated
3D01300 - SEMI 3D13 - Guide for Measuring Voids in Bonded Wafer Stacks StdVol-Gases orgで入手可能となる。初版は1989年発行。前版は2003年3月発行。This Guide will assist users in selection and use of bond void metrology equipment and a protocol for performing bond void measurements based on their application. New bonding processes and applications are sensitive to significantly smaller voids than bonding processes currently used for 3DS IC package sealing. This Guide is based on experimental data on 300 mm diameter silicon wafer pairs. The inspection and metrology tools covered include only
US$ 60.00
US$ 128.00
US$ 145.00
US$ 150.00
US$ 28.00