Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods Ingestion-build-51215 This standard does not apply

Name: Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods Ingestion-build-51215 This standard does not apply
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SKU: 65289903060
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Description

This standard does not apply to components manufactured by further processing of the product forms with quality characteristics altered as a result of such further processing

this part of ISO 1920 requires that field-prepared specimens be marked

The units can be leg-mounted

Note 3: Temporary protection and maintenance of anodized aluminium after anodizing may be necessary

Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods Ingestion-build-51215 This standard does not apply

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