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This flange is to be mounted to the floor within the volume defined by the equipment loadport standards
本スタンダードは，Gases Global Technical Committeeで技術的に承認されている。現版は2013年6月4日，global Audits and Reviews Subcommitteeにて発行が承認された。2013年6月にwww
The results of this test can be used for the qualitative ranking of gas delivery components based on the design as it relates to moisture dry-down performance of the system
The interface specified in this Standard is designed for a tool with a sealed minienvironment
3D00200 - SEMI 3D2 - Specification for Glass Carrier Wafers for 3DS-IC Applications Lang-Japanese This flange is to beNOTICE: This Document was reapproved with minor editorial changes. This Specification is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure glass carrier wafers to be used in a 3DS IC process. This Specification describes dimensional, thermal, and wafer preparation characteristics for glass starting material that will be used as carrier wafers in a temporary bonded state. This Specification