3D00500 - SEMI 3D5 - Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures StdTpc-Chemical & Gas Distribution Systems 12-94 (technical revision)

12-94 (technical revision)

The scope of this Document is limited to the definitions of terms used to specify measured quantities that characterize TSV

The need for ppb moisture standards is addressed by specifying procedures for reducing the output of ppm moisture standards to the ppb range

This edition was approved for publication by the global Audits and Reviews Subcommittee on December 13

3D00500 - SEMI 3D5 - Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures StdTpc-Chemical & Gas Distribution Systems 12-94 (technical revision)This Guide will assist the user in selection and use of tools for performing measurements of geometrical parameters of an individual through silicon via (TSV), or of an array of TSVs. TSVs are expected to be a critical element in future three dimensional stacked integrated circuit (3DS IC) packaging. Advanced TSV designs with higher aspect ratios and smaller diameters may challenge TSV metrology techniques. This Guide will address the various