3D01000 - SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack StdPbc-0920 holes) in thin silicon slices

holes) in thin silicon slices

and Flatness of Bonded Wafer Stacks

Suitable analytical procedures are defined in each standard for each grade of liquid chemical such that their sensitivity meets the requirements of each of the respective grades of liquid chemicals

0% min and Ethyl benzene 1% max

3D01000 - SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack StdPbc-0920 holes) in thin silicon slices1 Purpose 1. 1 This Guide is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS IC process. 2 Scope 2. 1 This Guide provides the tools to describe individual wafers in a 3DS IC process. In particular, this Document provides direction for describing the dimensions, materials, and devices for wafers that have undergone processing and are entering 3D stacking